AGFA023R24C2E1V System On Chip (SoC)_Huizhong Dingtai_Passive Components_Memory Memory_Data Memory_Wires&Cables_Circuit Protection_Power Supply_Semiconductors_Optoelectronic Products_Sensors

Part number：	AGFA023R24C2E1V
Product classification：	System On Chip (SoC)
Manufacturer：	Intel
Description：	IC
Encapsulation：
Packing：	Tray
Quantity：	0
RoHS status：	NO
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Part number：

AGFA023R24C2E1V

Product classification：

System On Chip (SoC)

Manufacturer：

Intel

Description：

Encapsulation：

Packing：

Tray

Quantity：

RoHS status：

Product parameters

TYPE	DESCRIPTION
Mfr	Intel
Series	Agilex F
Package	Tray
Product Status	ACTIVE
Package / Case	2340-BFBGA Exposed Pad
Speed	1.4GHz
RAM Size	256KB
Number of I/O	480
Operating Temperature	0°C ~ 100°C (TJ)
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes	FPGA - 2.3M Logic Elements
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DMA, WDT
Supplier Device Package	2340-BGA (45x42)
Architecture	MPU, FPGA

Alternative models

                                          AGFA023R24C2E1V                                        

                                          英特尔-Intel                                        

                                        英特尔® Agilex™ 7 F 系列 023 FPGA                                      

                                          AGFA023R24C2E1VB                                        

                                          英特尔-Intel                                        

                                        英特尔® Agilex™ 7 F 系列 023 FPGA                                      